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ACM Research, Inc. ("ACM") (NASDAQ:ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced major upgrades to its Ultra C wb cleaning tool. These new enhancements are designed to meet the demanding technical requirements of advanced-node manufacturing processes.
The upgraded Ultra C wb features a patent-pending nitrogen (N2) bubbling technology to solve poor wet etching uniformity and by-product regrowth. These issues frequently appear in conventional wet bench processes of phosphoric acid in high aspect ratio trenches and via structures in advanced-node processes. ACM's patent-pending N2 bubbling technique enhances the transport efficiency of phosphoric acid and promotes the uniformity of temperature, concentration and flow velocity in wet etching bath. The improved mass transfer efficiency of the wet etching process avoids by-product accumulation in wafer micro-structures to prevent regrowth. This technology holds significant application potential in the wet etching process for manufacturing 3D DRAM, 3D logic and 500+ layer 3D NAND devices.
Posted In: ACMR
