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Reported Earlier, SK hynix And TSMC Collaborate On HBM4 Development And Next-Generation Packaging Technology

Author: Benzinga Newsdesk | April 19, 2024 01:43am

SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation packaging technology
SK hynix will adopt TSMC's cutting-edge foundry process to advance HBM4 performance
Product Design-Foundry-Memory trilateral collaboration to break memory performance limits for AI applications

Posted In: TSM